Meet Us at PACK EXPO International 2026 in Chicago!
Experience Innovative Packaging Technology from AVENTUS
Visit us from October 18-21, 2026 at PACK EXPO International 2026, North America’s premier trade show for packaging and processing technologies. Together with HAVER & BOECKER USA, we will showcase high-performance packaging solutions for demanding bulk material applications. As a co-exhibitor, AVENTUS North America will be presenting the latest developments in bagging and digitalization technologies.
Take the opportunity to meet our experts in person, discover the latest innovations, and discuss the future of efficient packaging operations.
Our Highlights at PACK EXPO International 2026
TOPAS XL: High-Speed Packaging at Its Best
With the TOPAS XL, we are presenting the most powerful solution within the TOPAS product family. Designed specifically for demanding high-end applications, the system delivers maximum throughput, outstanding availability, and reliable continuous operation.
As one of AVENTUS’ fastest solutions for filling granular products into FFS bags, the TOPAS XL combines speed, precision, and efficiency at the highest level.
- Designed for maximum performance requirements
- Built for continuous high-capacity operation
- Optimized for maximum packaging efficiency
- Ideal for applications focused on throughput and availability
Q-Connect : Keep Your Packaging Line Connected
Discover how Q-Connect can accelerate the digital transformation of your packaging operations. The AVENTUS IIoT platform provides a centralized overview of machine conditions, production data, and key performance indicators.
By intelligently connecting your equipment, Q-Connect enables greater transparency, faster decision-making, and continuous optimization of your production processes.
Learn more about Q-Connect here: Q-Connect
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